Eric Monier-Vinard, Najib Laraqi, Cheikh Tidiane Dia, Minh-Nhat Nguyen, Valentin Bissuel. Analytical Modeling of Multi-Layered Printed Circuit Board Using Multi-Stacked via Clusters as Component Heat Spreader.
Thermal Science, VINČA Institute of Nuclear Sciences, 2016, 20 (5), pp.1633-1647.
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