Skip to Main content Skip to Navigation
Journal articles

Analytical Modeling of Multi-Layered Printed Circuit Board Using Multi-Stacked via Clusters as Component Heat Spreader

Abstract : In order to help the electronic designer to early determine the limits of the power dissipation of electronic component, an analytical model was established to allow a fast insight of relevant design parameters of a multi-layered electronic board constitution. The proposed steady-state approach based on Fourier series method promotes a practical solution to quickly investigate the potential gain of multi-layered thermal via clusters. Generally, it has been shown a good agreement between the results obtained by the proposed analytical model and those given by electronics cooling software widely used in industry. Some results highlight the fact that the conventional practices for Printed Circuit Board modeling can be dramatically underestimate source temperatures, in particular with smaller sources. Moreover, the analytic solution could be applied to optimize the heat spreading in the board structure with a local modification of the effective thermal conductivity layers.
Keywords : Pas de mot-clé
Complete list of metadatas

https://hal-univ-paris10.archives-ouvertes.fr/hal-01473744
Contributor : Administrateur Hal Nanterre <>
Submitted on : Wednesday, February 22, 2017 - 11:14:54 AM
Last modification on : Tuesday, November 19, 2019 - 9:46:26 AM

Identifiers

  • HAL Id : hal-01473744, version 1

Citation

Eric Monier-Vinard, Najib Laraqi, Cheikh Tidiane Dia, Minh-Nhat Nguyen, Valentin Bissuel. Analytical Modeling of Multi-Layered Printed Circuit Board Using Multi-Stacked via Clusters as Component Heat Spreader. Thermal Science, VINČA Institute of Nuclear Sciences, 2016, 20 (5), pp.1633-1647. ⟨hal-01473744⟩

Share

Metrics

Record views

108