Free Convective Overall Heat Transfer Coefficient on Inclined Electronic Assembly with Active QFN16 Package

Abstract : The purpose of this paper is to determine the overall free convective heat transfer coefficient for an assembly constituted by a Quad Flat Non-lead QFN16 welded on a Printed Circuit Board (PCB) which may be inclined with respect to the horizontal plane by an angle varying between 0° and 90° corresponding to the horizontal and vertical position, respectively. This electronic device widely used in electronics generates during its effective operation a power ranging from 0.1 to 0.8 W. The assembly is installed in an air-filled cavity.