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Free Convective Overall Heat Transfer Coefficient on Inclined Electronic Assembly with Active QFN16 Package

Abstract : The purpose of this paper is to determine the overall free convective heat transfer coefficient for an assembly constituted by a Quad Flat Non-lead QFN16 welded on a Printed Circuit Board (PCB) which may be inclined with respect to the horizontal plane by an angle varying between 0° and 90° corresponding to the horizontal and vertical position, respectively. This electronic device widely used in electronics generates during its effective operation a power ranging from 0.1 to 0.8 W. The assembly is installed in an air-filled cavity.
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https://hal-univ-paris10.archives-ouvertes.fr/hal-01473754
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Submitted on : Wednesday, February 22, 2017 - 11:15:04 AM
Last modification on : Tuesday, November 19, 2019 - 9:46:24 AM

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Abderrahmane Baïri. Free Convective Overall Heat Transfer Coefficient on Inclined Electronic Assembly with Active QFN16 Package. International Journal of Numerical Methods for Heat and Fluid Flow, Emerald, 2016, 26 (5), pp.1446-1459. ⟨10.1108/HFF-04-2015-0142⟩. ⟨hal-01473754⟩

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